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October 2005

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Subject:
From:
"Barmuta, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barmuta, Mike
Date:
Wed, 5 Oct 2005 08:26:32 -0700
Content-Type:
text/plain
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text/plain (59 lines)
Hi Franklin: The idea is good however it's already covered in the existing
forum. Although most of the questions are assembly related it is open to all
areas covered by IPC including bare boards. Possibly some subscribers are
not aware of this and believe it's only for assembly.

If the demand is great enough I guess it could be pursued but I don't see
the need to create another level or subset.

Jack?

                                        Best Regards
                                                      Michael Barmuta
                                                      Staff Engineer
                                                      Fluke Corp.
                                                      Everett WA
                                                      425-446-6076






-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Franklin Asbell
Sent: Wednesday, October 05, 2005 8:05 AM
To: [log in to unmask]
Subject: [TN] New IPC email forum


With a show of hands (yes, we can see you) how many out there would be
interested in subscribing to an IPC email forum for pcb (rigid, flex,
rigid-flex, hi-rel, mil, etc) fabrication topics.

Franklin

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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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