Diffusion

Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Friday, October 28, 2005 10:55 PM
To: [log in to unmask]
Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS

In a message dated 10/28/2005 4:50:15 PM US Eastern Standard Time,
[log in to unmask] writes:
Hello,

When someone equated soldering to that of salt dissoving in water, it
threw
me for a loop.  Now I am wondering if someone willing to explain how an
inter-metallic bond is formed when one of the metals (Ni, in the example
below) is not in a liquid state?


Thank you in advance,

David
Actually it is a dissolution process very similar to the salt and water
example.

Jon Moore

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