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October 2005

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Subject:
From:
"Barmuta, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barmuta, Mike
Date:
Fri, 28 Oct 2005 15:39:42 -0700
Content-Type:
text/plain
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text/plain (193 lines)
David: All constituents do not have to be in a liquid state. In this case
the Ni dissolves into the liquid Sn of the Sn/Pb solder paste.

                                                        Regards

                                                                Mike Barmuta

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Tremmel
Sent: Friday, October 28, 2005 2:48 PM
To: [log in to unmask]
Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS


Hello,

When someone equated soldering to that of salt dissoving in water, it threw
me for a loop.  Now I am wondering if someone willing to explain how an
inter-metallic bond is formed when one of the metals (Ni, in the example
below) is not in a liquid state?


Thank you in advance,

David


>From: "Barmuta, Mike" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              "Barmuta,
>Mike" <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS
>Date: Fri, 28 Oct 2005 12:57:03 -0700
>
>Richard: Affinity of the solder and base metal to form an intermetallic
>reaction.
>I hope you're not running your reflow at 2500F!
>
>                                         Regards
>
>                                                 Mike Barmuta
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
>Sent: Friday, October 28, 2005 11:46 AM
>To: [log in to unmask]
>Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS
>
>
>Mike, how do you form a solder joint with the nickel if the nickel does
>not melt?
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Barmuta, Mike
>Sent: Friday, October 28, 2005 10:43 AM
>To: [log in to unmask]
>Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS
>
>Hi Susan: No, there is no need to increase the reflow oven to Pb free
>temperatures.
>
>First the flux in his Sn/Pb solderpaste is not desinged to go to those
>temps, so the results will probbaly be worse.
>
>Second it is not nessesry to get the SAC coating on the part up to it's
>melting point to create a good solderjoint. Think of soldering to Ni.
>You don't have to reach the melting point of the Ni.
>
>Since you have not provided any information on the reflow times and
>temps or type of flux all I can do is give you a general direction. I
>would start with an increase in the dwell time above liquidous, 70-80
>secs, and a peak of 220-225 C.
>
>
>Regards
>
>Michael Barmuta
>
>Staff Engineer
>
>Fluke Corp.
>
>Everett WA
>
>425-446-6076
>
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
>Sent: Friday, October 28, 2005 8:08 AM
>To: [log in to unmask]
>Subject: [TN] LEAD FREE PART IN SNPB PROCESS
>
>
>Happy Friday to All
>I have a customer who is now being supplied with parts that the
>terminations are SnAgCu (95.5/4/0.5) instead of the previous SnPb.
>
>His process is not lead free and the parts are not always wetting and
>forming an adequate joint.
>
>What are his choices?  Can he/should he take his SnPb line to lead free
>temps in an attempt to solder these parts - reflow process?
>
>Thanks for your advice
>
>Susan Mansilla
>Robisan Lab
>
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