Richard: Affinity of the solder and base metal to form an intermetallic
reaction.
I hope you're not running your reflow at 2500F!
Regards
Mike Barmuta
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
Sent: Friday, October 28, 2005 11:46 AM
To: [log in to unmask]
Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS
Mike, how do you form a solder joint with the nickel if the nickel does
not melt?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barmuta, Mike
Sent: Friday, October 28, 2005 10:43 AM
To: [log in to unmask]
Subject: Re: [TN] LEAD FREE PART IN SNPB PROCESS
Hi Susan: No, there is no need to increase the reflow oven to Pb free
temperatures.
First the flux in his Sn/Pb solderpaste is not desinged to go to those
temps, so the results will probbaly be worse.
Second it is not nessesry to get the SAC coating on the part up to it's
melting point to create a good solderjoint. Think of soldering to Ni.
You don't have to reach the melting point of the Ni.
Since you have not provided any information on the reflow times and
temps or type of flux all I can do is give you a general direction. I
would start with an increase in the dwell time above liquidous, 70-80
secs, and a peak of 220-225 C.
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett WA
425-446-6076
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
Sent: Friday, October 28, 2005 8:08 AM
To: [log in to unmask]
Subject: [TN] LEAD FREE PART IN SNPB PROCESS
Happy Friday to All
I have a customer who is now being supplied with parts that the
terminations are SnAgCu (95.5/4/0.5) instead of the previous SnPb.
His process is not lead free and the parts are not always wetting and
forming an adequate joint.
What are his choices? Can he/should he take his SnPb line to lead free
temps in an attempt to solder these parts - reflow process?
Thanks for your advice
Susan Mansilla
Robisan Lab
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