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October 2005

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Subject:
Re: LEAD FREE PART IN SNPB PROCESS
From:
Phillip Bavaro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phillip Bavaro <[log in to unmask]>
Date:
Fri, 28 Oct 2005 14:28:03 -0700
Content-Type:
text/plain
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text/plain (49 lines) 
Hi Susan,

It is something you will have to adjust to....

Raise the reflow process temperature from 220 max to 230-235.

This will allow the formation of reliable solder joints and hopefully not damage the rest of the parts.  Handsolder the ones that are susceptible.

I have used this process for almost two years with very little fallout but you should check the first board very closely to be sure that none of the connector bodies degrade.

Phil


Susan Mansilla <[log in to unmask]> wrote:
Happy Friday to All
I have a customer who is now being supplied with parts that the terminations
are SnAgCu (95.5/4/0.5) instead of the previous SnPb.

His process is not lead free and the parts are not always wetting and forming
an adequate joint.

What are his choices? Can he/should he take his SnPb line to lead free temps
in an attempt to solder these parts - reflow process?

Thanks for your advice

Susan Mansilla
Robisan Lab

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