All -


I would like to ask for any input regarding BGA reballing techniques.


The organization for which I work is NOT interested in outsourcing the
reballing of our reworked BGA devices (read: not cost effective).  And, to
that end, we are currently using a standard stencil, paste, ball, bake
method.

However, the question I pose is this: Does anyone have any experience with
techniques beyond the standard use of stencils, paste, balls, etc?  For
example, I found a product offered by Hepco that offers a vacuum method, no
paste involved... looks kind of interesting.  Has anyone tried this before?
Check out: http://www.hepcoblue.com/


Second question related to BGA rework.  Does anyone know of a good used
equipment contact/website?  We currently have one BGA rework machine and are
looking for at least one, potentially two more.


I look forward to everyone's input.

On a personal side note:
1.) Congratulations, Steve, on your award.  I certainly have learned a lot
from Tech Net, and your efforts in particular have been instrumental in
coordinating the efforts between strangers in strange lands.  We all owe you
a certain amount of "thanks."

2.) For those in California, please understand, before you read this, that I
bleed orange:
GO HORNS - #1 in the BCS!!!


Kind Regards,
Dacia Schoolfield
Avant Technology
Quality Manager
UT Texas-Austin Graduate - 2006

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