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October 2005

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Subject:
From:
"Barmuta, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barmuta, Mike
Date:
Fri, 28 Oct 2005 08:43:11 -0700
Content-Type:
text/plain
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text/plain (75 lines)
Hi Susan: No, there is no need to increase the reflow oven to Pb free
temperatures.

First the flux in his Sn/Pb solderpaste is not desinged to go to those
temps, so the results will probbaly be worse.

Second it is not nessesry to get the SAC coating on the part up to it's
melting point to create a good solderjoint. Think of soldering to Ni. You
don't have to reach the melting point of the Ni.

Since you have not provided any information on the reflow times and temps or
type of flux all I can do is give you a general direction. I would start
with an increase in the dwell time above liquidous, 70-80 secs, and a peak
of 220-225 C.


Regards

Michael Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-446-6076



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
Sent: Friday, October 28, 2005 8:08 AM
To: [log in to unmask]
Subject: [TN] LEAD FREE PART IN SNPB PROCESS


Happy Friday to All
I have a customer who is now being supplied with parts that the terminations
are SnAgCu (95.5/4/0.5) instead of the previous SnPb.

His process is not lead free and the parts are not always wetting and
forming an adequate joint.

What are his choices?  Can he/should he take his SnPb line to lead free
temps in an attempt to solder these parts - reflow process?

Thanks for your advice

Susan Mansilla
Robisan Lab

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