Hi Susan,

there are 2 issues with the Pb-free components: they have to be lead-free and they have to be able to withstand the new reflow temperatures.

So your customer should properly solder this component by raising the temperature. But will the other components, including the PCB, stand it? I had a nasty experience with certain PCBs and it is not fun to put on the parts only to get a nice delamination at the end of the oven.

He still has the option to tin the components...

Regards,
Ioan

> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Susan Mansilla
> Sent: Friday, October 28, 2005 11:08 AM
> To:   [log in to unmask]
> Subject:      [TN] LEAD FREE PART IN SNPB PROCESS
> 
> Happy Friday to All
> I have a customer who is now being supplied with parts that the terminations
> are SnAgCu (95.5/4/0.5) instead of the previous SnPb.
> 
> His process is not lead free and the parts are not always wetting and forming
> an adequate joint.
> 
> What are his choices?  Can he/should he take his SnPb line to lead free temps
> in an attempt to solder these parts - reflow process?
> 
> Thanks for your advice
> 
> Susan Mansilla
> Robisan Lab
> 
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