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Subject:	Re: LEAD FREE PART IN SNPB PROCESS
From:	Jason Gregory <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Jason Gregory <[log in to unmask]>
Date:	Fri, 28 Oct 2005 10:13:57 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (57 lines)

Another fine example of the lead-free debacle. (Sigh, it's getting
ridiculous - soon we won't be able to find leaded parts even if our
assemblies don't have to follow the RoHS directive)


Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)212-0844 cell
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
Sent: Friday, October 28, 2005 10:08 AM
To: [log in to unmask]
Subject: [TN] LEAD FREE PART IN SNPB PROCESS

Happy Friday to All
I have a customer who is now being supplied with parts that the terminations
are SnAgCu (95.5/4/0.5) instead of the previous SnPb.

His process is not lead free and the parts are not always wetting and
forming an adequate joint.

What are his choices?  Can he/should he take his SnPb line to lead free
temps in an attempt to solder these parts - reflow process?

Thanks for your advice

Susan Mansilla
Robisan Lab

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