We test all boards as the last process before final cleaning, regardless
of finish.  Both Grid and Probe testing methods have been assessed to
ensure the pressure is well controlled and the verification of the test
setup is done prior to each run. We have had good success with a few
issue with the human element.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Parsons
Sent: Thursday, October 27, 2005 4:07 PM
To: [log in to unmask]
Subject: [TN] FAB: Test Methodology for "Alternate" finishes?

I would like to get an idea for how and where in the process other
fabricators are electrically testing boards with finishes such as tin,
silver or OSP which can be easily damaged by test probes/pins.  Due to
the
inherent risks of testing the boards "in-process" prior to the final
finish
being applied (subsequent damage from handling etc.) I am hesitant to
recommend this course of action but most of the chemistry suppliers we
have
spoken to say that this is what most other shops are doing.  Is this
true?



Microcraft have suggested a number of options for our probe, anything
from
inexpensive contact pressure adjustments to more costly replacement
probe
heads.  What about fixture (grid) testers?  Are people using domed pins,
testing in-process or what?



As always, any input is much appreciated.



Best Regards,

John Parsons
Enigma Interconnect Inc. - Vancouver






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