I would like to get an idea for how and where in the process other
fabricators are electrically testing boards with finishes such as tin,
silver or OSP which can be easily damaged by test probes/pins.  Due to the
inherent risks of testing the boards "in-process" prior to the final finish
being applied (subsequent damage from handling etc.) I am hesitant to
recommend this course of action but most of the chemistry suppliers we have
spoken to say that this is what most other shops are doing.  Is this true?



Microcraft have suggested a number of options for our probe, anything from
inexpensive contact pressure adjustments to more costly replacement probe
heads.  What about fixture (grid) testers?  Are people using domed pins,
testing in-process or what?



As always, any input is much appreciated.



Best Regards,

John Parsons
Enigma Interconnect Inc. - Vancouver






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