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October 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Thu, 27 Oct 2005 11:31:22 -0400
Content-Type:
text/plain
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text/plain (107 lines)
This is actually the only process that has a positive impact on black
pad, although the issue with gold level in the solder fillet is the same
in either process.  Rather than plague the finish with another host of
issue - try another finish.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ray, Carl (GE
Infrastructure)
Sent: Thursday, October 27, 2005 9:22 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG and brittleness

I got one for you guys....... I have a board house who claims to have
created a process the eliminate the "Black Pad" issue while decreasing
the gold brittle issues of ENIG finishes. They claim a thin layer of
Palladium between the gold and nickel does the trick... I am not
familiar with this process and have requested more data from the board
supplier to support their claims.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Wednesday, October 26, 2005 11:25 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG and brittleness


Hi Eddie,
You will not find such information.
First, while ENIG can lead to brittle interfacial separations, it does
not
lead to brittle solder joints--as in 'gold embrittlement.' the
difference is in
the failur mode, the separation would be at the Ni/Ni-IMC interface, not
the
solder per se.
Second, while some people claim to have suppliers who do not produce
ENIG
suffering from 'Black Pad' brittle interfacial separations, many reports
of
ENIG-'Black Pad' failures are documented.
Thus, the real question is why is your customer looking to convert to
ENIG,
and what is he converting from?

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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