Palnic then? Or near..
Personally I would not be hopeful that would likely be an improvement from a
soldering point of view.
Interested to hear your experiences if you go that route.
Regards
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ray, Carl (GE
Infrastructure)
Sent: 27 October 2005 14:22
To: [log in to unmask]
Subject: Re: [TN] ENIG and brittleness
I got one for you guys....... I have a board house who claims to have
created a process the eliminate the "Black Pad" issue while decreasing the
gold brittle issues of ENIG finishes. They claim a thin layer of Palladium
between the gold and nickel does the trick... I am not familiar with this
process and have requested more data from the board supplier to support
their claims.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Wednesday, October 26, 2005 11:25 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG and brittleness
Hi Eddie,
You will not find such information.
First, while ENIG can lead to brittle interfacial separations, it does not
lead to brittle solder joints--as in 'gold embrittlement.' the difference is
in the failur mode, the separation would be at the Ni/Ni-IMC interface, not
the solder per se.
Second, while some people claim to have suppliers who do not produce ENIG
suffering from 'Black Pad' brittle interfacial separations, many reports of
ENIG-'Black Pad' failures are documented.
Thus, the real question is why is your customer looking to convert to ENIG,
and what is he converting from?
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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