this is an interesting approach. however, once the palladium is
deposited, why add the gold?
phil
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ray, Carl (GE
Infrastructure)
Sent: Thursday, October 27, 2005 6:22 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG and brittleness
I got one for you guys....... I have a board house who claims to have
created a process the eliminate the "Black Pad" issue while decreasing
the gold brittle issues of ENIG finishes. They claim a thin layer of
Palladium between the gold and nickel does the trick... I am not
familiar with this process and have requested more data from the board
supplier to support their claims.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Wednesday, October 26, 2005 11:25 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG and brittleness
Hi Eddie,
You will not find such information.
First, while ENIG can lead to brittle interfacial separations, it does
not lead to brittle solder joints--as in 'gold embrittlement.' the
difference is in the failur mode, the separation would be at the
Ni/Ni-IMC interface, not the solder per se.
Second, while some people claim to have suppliers who do not produce
ENIG suffering from 'Black Pad' brittle interfacial separations, many
reports of ENIG-'Black Pad' failures are documented.
Thus, the real question is why is your customer looking to convert to
ENIG, and what is he converting from?
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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