I got one for you guys....... I have a board house who claims to have created a process the eliminate the "Black Pad" issue while decreasing the gold brittle issues of ENIG finishes. They claim a thin layer of Palladium between the gold and nickel does the trick... I am not familiar with this process and have requested more data from the board supplier to support their claims.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Wednesday, October 26, 2005 11:25 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG and brittleness
Hi Eddie,
You will not find such information.
First, while ENIG can lead to brittle interfacial separations, it does not
lead to brittle solder joints--as in 'gold embrittlement.' the difference is in
the failur mode, the separation would be at the Ni/Ni-IMC interface, not the
solder per se.
Second, while some people claim to have suppliers who do not produce ENIG
suffering from 'Black Pad' brittle interfacial separations, many reports of
ENIG-'Black Pad' failures are documented.
Thus, the real question is why is your customer looking to convert to ENIG,
and what is he converting from?
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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