Hi Eddie,
You will not find such information.
First, while ENIG can lead to brittle interfacial separations, it does not
lead to brittle solder joints--as in 'gold embrittlement.' the difference is in
the failur mode, the separation would be at the Ni/Ni-IMC interface, not the
solder per se.
Second, while some people claim to have suppliers who do not produce ENIG
suffering from 'Black Pad' brittle interfacial separations, many reports of
ENIG-'Black Pad' failures are documented.
Thus, the real question is why is your customer looking to convert to ENIG,
and what is he converting from?

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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