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Background information from one who  participated in the development of the 
equivalence factors for the  Navy. 
CLEANING SMT February 1998   

IONIC TESTING: A  PRIMER. 
By William G. Kenyon 
Industry users continue to ask about the ionic test  method that was first 
published in MIL-P-28809 and now appears in the  J-STD-001B.  As one of the 
people  involved in the development of the equivalence factors, I decided to write 
this  column as a “public service” for both experienced and new members of 
our  industry. 
T.  F. Egan  of Bell Labs was looking for a way to determine if gold plated 
parts were clean  enough for spot welding.  He devised  a test method that 
immersed a given number of such parts in deionized water,  measuring the 
conductivity of the water before and after the parts were  introduced.  Because the 
parts were  identical, limiting controlling the number of parts controlled the 
surface area  exposed to the DI water.  Since this  test was only concerned with 
plating salt residues, the use of DI water,  pre-equilibrated with air to 
eliminate the effect of carbon dioxide, was a good  choice.  Egan looked at the 
delta C  in the conductivity before and after the test.  If there was less than 
1.0 micromho/cm  increase for an area of 5 sq.  in.,  the parts were clean 
enough to go to the production line.  If not, they were re-rinsed until they  
passed, plus the rinsing steps in the plating line were checked to make sure  
they met process standards, with corrective action taken as needed.   
In the early 1970s, the military was encountering  numerous failures in 
radios and other conformally coated electronic hardware  deployed in Southeast 
Asia.  After investigation, the Navy lab in  Indianapolis  found the cause to be 
the ionic residues under the conformal coatings.  These residues would react 
with the  water vapor that permeated the coatings, which turned to liquid if  
conditions dropped below the dew point.   The ionics, dissolved in liquid  
water, could conduct current under the coating to cause the failures.  Since the 
organic conformal coatings are  all permeable to water vapor, the key was to 
eliminate, or significantly reduce,  the ionic residues.  The various  phases of 
this project were published as Material Research Reports (MRR).  First, the 
flux residue had to be  dissolved away from the assembly surface so the ionics 
could be measured.  The Navy   
group tested a number of 2-propanol/deionized water  mixtures for their 
ability to dissolve the solvent cleaned rosin flux  residues found on military 
hardware of that era.  The best solution was a 75/25  volume/volume 
2-propanol/deionized water mixture.  Next, the team had to determine how to  wash the test 
boards and what pass/fail limits should be used.  So this phase was based on 
the Egan  test.  Thus a given volume of test  fluid was applied via a wash 
bottle per given area of PWA surface (10  milliliters per square inch).  The  
solution was purified by passage through a resin bed so the resistivity was  higher 
than 6 megohm-cm.  After the  washings had been collected in a clean vessel, 
the final resistivity was  measured.  It had to be above 2  megohm-cm.  
Titration of the test  solution with standardized NaCl solution showed that ionics 
equivalent to 1.26  micrograms of NaCl/sq.  cm.  of PWA surface would drop the  
resistivity from 6 to 2 megohm-cm.  The starting and final resistivity 
numbers were developed using the  levels on PWAs that performed satisfactorily in 
field service.  At this point the Navy had developed a  standardized test 
solution to remove a known flux residue, plus a test method to  measure the ionics 
and a pass/fail criteria based on field data (MRR 3-72).  The method issued in  
MIL-P-28809; Printed Wiring Assemblies, March, 1975.  (The spec first issued 
as MIL-P-XXXXX or  “MIL-P-Quint X”, to use the verbal shorthand of the  
time.) 
The flux makers developed commercial instruments for  automating the 
cleanliness test found in MIL-P-28809.  First the Ionograph™, providing data in  terms 
of conductivity, then the Omegameter™, using resistivity.   At that time, all 
military work  was done within the military specification system, so any 
change had to be  authorized by a waiver or deviation.  The military allowed a 
single waiver for use of the Ionograph™ (see MRR  5-75) instead of the wash 
bottle technique, then later a corresponding waiver  was developed and issued for 
the Omegameter™ (see MRR 10-76).  Other military contractors wanting to  use 
these instruments would then cite this documentation in applying for their  
waiver.  The paperwork for waivers  soon got so out of hand that the Navy lab in 
Indianapolis had to develop a method to  eliminate the waivers, thus allowing 
contractors to use any of several methods  to comply with the cleanliness test 
requirements in their  contracts. 
This was the beginning of the equivalence factor work,  which has caused a 
great deal on confusion.  At the time, the Navy, realizing that  component area 
was quite significant, developed component area measurements for  all the 
components used for military work.  The user would then just measure the length 
and width of the PWB,  multiply to get the area of one side, double it to get 
the area of both sides  and then add the sum of the component areas to get the 
full surface area of the  PWA to be tested.  The Navy lab  developed a series 
of test boards and two lab fluxes that would simulate RMA and  RA fluxes for 
use in a test plan to qualify the various commercial test  instruments for 
general use.  An  expert group, including the inventors of the commercial 
instruments, was invited  to Indianapolis  to help review and interpret the resulting 
data.  The activator level in the RMA flux was  really in the RA range, so we 
were faced with a single data set instead of the  planned two sets.  The 
instruments  included two resistivity/conductivity bridges (Beckman and Markson), 
the  Ionograph™, the Omegameter™ and the non-commercial Ion Chaser.  Since the 
military assemblies of the  time included examples of all the different 
components, we pooled the data for  each instrument to determine the average 
contamination level for all test boards  for a given instrument.  Next, the  averages 
for the two bridges were averaged, so we now had four averages.  The average 
for the bridges was chosen  as the standard, since the bridge was used as the 
original measurement  instrument.  The data sets were then  normalized by 
dividing the average for each instrument by the grand average for  the bridges.  
This gave the  “equivalence factors” for each instrument, with the bridges set 
equal to  1.0.   Next, each equivalence  factor was multiplied by 1.56 
micrograms NaCl/sq.  cm.  to give the pass/fail limit for that  instrument equal to 
the Mil-P-28809 limit of 2 megohm-cm.  Then, the resulting numbers were  
multiplied by 6.452 to convert them to the values needed to express the  pass/fail 
limit or instrument acceptance limit” when the area was measured in  square 
inches. (The higher 1.56 micrograms NaCl/sq.  cm.  number instead of the 
original 1.28 came  into use when I modified the electronics in an OmegaMeter 300 to 
give a 3X scale  expansion on the digital resistivity meter.  This showed that 
the clean solution was  really much higher than the 6 megohm-cm used to get 
the 1.28 micrograms  NaCl/sq.  cm.  value.) 
The details of the equivalence factor study can be found  in MRR 3-78.  The  
report concludes:  “All of the  instruments tested are suitable for 
determining ionic contaminants remaining  after solvent cleaning of post-soldering 
rosin-flux residues as described in  MIL-P-28809 providing the interim equivalence 
factors are employed.”  Meanwhile, W. B. Wargotz of Bell  Laboratories had 
been studying the deleterious effect of NaCl residues on  telecom boards and 
subjecting them to the 40 year life test.  Wargotz reported at the Fall,  78 IPC 
meeting that levels of less than  1 microgram NaCl/cm2 passed the 40 year life 
test, while levels of 7  micrograms NaCl/cm2 or higher would fail.  The 1-7 
micrograms NaCl/cm2  range was a grey area.  Above 7 was a guaranteed failure 
area. However, the correlation of this  laboratory data with the empirical Navy 
data validated the pass/fail limit  established in MRR 3-72 and confirmed in 
MRR 3-78.   
At this point the industry had a valid test method for  measuring ionics  
from solvent  cleaned post-soldering rosin-flux residues.  The question of 
validity of the interim  equivalence factors was addressed by an experimental study 
conducted by the  makers of the Omegameter™.  The  study concluded the 
equivalence factors were applicable to newer models of this  instrument.  At this 
point the  equivalence factors became fixed.   
Northern Telecom investigated the validity of using  ionic testing for 
water-soluble fluxes.  Their findings, presented at the IPC by NT’s T. Duyck in a 
report on  their Deltameter, showed a dramatic difference in release rate of the 
residues  of rosin fluxes and water soluble fluxes from the surface of the 
test  boards.   In the typical 10-15  minute test period, rosin flux residues 
were about 90% percent extracted, while  it took about two hours to achieve the 
same level of extraction with  water-soluble fluxes.  Thus, using  the 
standard ionic test method with water-soluble flux residues gave numbers  that were 
very low, but not representative of the residues that were really  present.  
Synthetic Activated (SA)  fluxes were tested for release rate and found to be as 
fast or faster than rosin  fluxes.  The standard method was  shown to be 
applicable to SA and rosin flux residues, but not to water-soluble  flux residues. 
 Later, when the  ozone depleting solvents used in the electronics industry 
were phased out, the  IPC Cleaning & Coating Committee re-examined ionic 
testing to determine the  proper test solution and pass/fail limit appropriate for 
residues from  alternative soldering/cleaning processes, including no clean.  
The reports of this task group are  available from IPC.   
The ionic test is still valid today for rosin flux  residues, provided the 
equivalence factors are used (J-STD-001C).  Since many users employ the test to  
comply with telecom requirements or to monitor their processes, the  
applicability to modern water-soluble and no clean flux residues needs to be  
established.  Investigations carried  out by IPC members showed that high loadings of 
adipic acid, a major ingredient  in most no clean fluxes, had little 
deleterious effect on surface insulation  resistance.  The ionic test is  difficult to 
use in this case, since adipic acid is not very soluble in typical  solvents 
or in water.  Advances in  water-soluble flux formulations to eliminate the 
polyethylene glycols that  degrade SIR provide us with a new set of residues that 
need to be assessed.  The ionic test has been such a valued  process 
monitoring tool in addition to providing reliable electronics that the  industry needs 
to press for the research needed to keep it current with today’s  soldering 
and cleaning technologies. 


[Had many requests for the full text of Feb98 column vs  the shortened 
version actually published, here is what was cut from that Feb.  col.] 

IONIC TESTING: PART  2. 
By: William G.  Kenyon 
Many readers have asked for more information on the  ionic testing primer 
provided in the February column.  I have expanded the text that was cut  from 
that column for space reasons, so between the two columns, a fairly  complete 
account is now available.  I will also try to answer some of the questions that 
have come up in the  intervening months. 
Q.  Why do we use 75/25 alcohol/water? 
A.  The Navy Lab that developed the test looked carefully at the test 
solution,  testing 25/75, 50/50 and 75/25 alcohol/water mixtures.  They found the 
50/50 and 25/75 mixtures  did not dissolve all the rosin matrix, thus not all the 
ionics were released  into the solution for measurement (MRR 5-77).  This is 
the reason 75/25 was selected as  the official test solution. 
Q.  Why not 50/50 alcohol/water, since it is  alleged to be “more sensitive”
? 
A.  Some workers, ignoring Q&A #1, looked at the larger numbers obtained with 
 50/50 compared with 75/25, and concluded it was “more sensitive.” In 
reality,  they were seeing the greater dissociation of incompletely dissociated 
ionic  materials.  In other words,  compounds like table salt are completely 
dissociated into ions as long as there  is minimum water present, while 
incompletely dissociated flux ingredients  dissociate into measurable ions depending on 
the amount of water present.  The more water in the test solution, the  greater 
the dissociation, and the higher the number; thus leading to the claim  of “
greater sensitivity”.  
Q. How  do you comply with MIL-P-28809 with a 50/50 test  solution? 
A.  Electronics makers in Europe often used ionic  test equipment designed to 
run on 50/50 alcohol/water, which gave significant  problems when trying to 
comply with MIL-P-28809 limits designed around  75/25.  Since the values from  
identical test boards run in 50/50 could be as much as 10x higher than the  
values from 75/25, some electronics makers were desperate when achieving of  only
” 2 micrograms/sq.  cm., which in real numbers could be as  low as 0.2  
micrograms/sq.  cm., when the pass/fail limit was  1.56  micrograms/sq.  cm.  Thus 
many electronics makers were either  over-cleaning or discarding valuable 
electronics hardware that was really quite  adequately cleaned.   
[In Europe, the  Contaminometer was used with 50/50 (ignoring the above) to 
compensate for the  rather insensitive Myron L conductivity probe used in it. 
The probe should be  0.01 but the Myron L had a cheap 0.1 probe which was fine 
for plating baths, but  not for this work.] 
Besides the promotion of the 50/50 as “more sensitive”,  there were also 
problems with some of the early versions of the test equipment,  especially the 
test cells.  Initially, many of these were made of acrylate plastic and the  
corresponding adhesives, which were not compatible with the more aggressive  
75/25 v/v test solution.  Once this  compatibility problem was recognized, the 
instrument makers quickly converted to  other plastics and the problem 
disappeared. [Note: MIL-P-28809 has been  canceled.  The ionic cleanliness  
requirements can now be found in ANSI  J-STD-001.] 
Q. Some  instruments use conductivity and some use resistivity.  Why? 
A. Conductivity,  which is linear, is the reciprocal of resistivity, which is 
logarithmic.  The Ionograph™ used conductivity, which  was also used by T. 
Egan at Bell Labs.  The advantage of conductivity was that a recent reading that 
was twice  what an earlier reading had been meant that your PWAs had twice as 
much ionic  residue on them. Resistivity values were not as easy to 
interpret, since we  don’t tend to think in powers of ten.  The Omegameter™, which 
used resistivity, did so in order to automate the  original Navy manual ionic 
testing procedure. Initially this caused much  confusion in the industry, until 
enough papers were published that the industry  was comfortable with the two 
systems.  
Q.  I’ve got an older Omegameter™ that uses a little slide rule to generate 
the  actual ionic cleanliness readings.  The meter on the machine goes up to 
20 megohm-cm, while the numbers on  the slide rule go up to 30 megohm-cm.  Can 
I just modify the circuitry of my instrument to take advantage of the  higher 
reading capability of the slide rule? 
A.  A careful check of the slide rule will show that you can paste in some 
log paper  (if you can find it) to continue the log scale to higher values.  
However, the electronics in the read-out  module of your instrument won’t track 
the log scale graph paper above 30  megohm-cm.  If you are planning on  doing a 
scale expansion from 20 megohm-cm to 60 megohm-cm, then it is best to  attach 
a precision resistance box to the terminals on the back of the instrument  
where the resistivity probe is usually attached.  Then track the actual 
resistance against  the readings to generate a graph of observed readings vs. actual 
values.   
[This  log paper patch worked quite well with my Omegameter™ 300.  We did a 
3x scale expansion on it as  described, I still have a copy of the report with 
the circuit design, which was  about $200 to build and install. The precision 
resistor box is not included in  the price.  The electronics in the  
Omegameter weren’t linear above about 30 megohm-cm. ] 
Q.  In the February article, you explained “equivalence factors”. Is there a 
 tabulation of these factors available? 
A.  The equivalence factors are summarized in this table, taken from MRR 
3-78, which  concludes: “All of the instruments tested are suitable for 
determining ionic  contaminants remaining after solvent cleaning of post-soldering 
rosin-flux  residues as described in MIL-P-28809 providing the interim equivalence 
factors  are employed.” 
Instrument  
Average  NaCl/in2  
Equivalence  Factor  
Acceptance  
Limit, micro- 
grams  
NaCl/cm2  
Acceptance Limit, micrograms   
NaCl/in2   
Beckman  bridge  
7.47  
1.56  
10.06   
Markson  bridge  
7.62  
1.56  
10.06   
Combined  bridges  
7.545  
1.0  
1.56  
10.06   
Ionograph™  
15.20  
2.01  
3.1  
20   
Omegameter™  
10.51  
1.39  
2.2  
14   
Ion  Chaser  
24.50  
3.25  
5.1  
33 
Loose Ends 
The Department of Defense, realizing that this work  needed to be extended to 
cover saponifier cleaned rosin flux residues plus water  cleaned water 
soluble flux, fusing fluid and hot air leveling fluid fluxes,  proposed new studies 
to determine the proper test solutions and pass/fail limits  for the residues 
from these technologies.  This work was never funded and thus never done (see 
Appendix 2, DoD  Soldering Standardization Study).    
[As I recall, this was published in 1978-1980  timeframe.] 
W G. KENYON, an SMT Editorial Advisory Board member, is  president of Global 
Centre Consulting,  3336 Birmingham Drive, Fort Collins, CO 80526-2336. Tel: 
(970)  207-9586;  Cell: (970)  980‑6373;email [log in to unmask] 
(mailto:[log in to unmask])    
PULL QUOTES 
The ionic  test is still valid for rosin and SA flux residues, provided the  
equivalence factors are used.”                            --End--

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