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October 2005

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Thu, 20 Oct 2005 13:38:45 -0400
Content-Type:
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        Solid P/G layers or  solid power / ground planes do not adhere
to epoxy glass ( more pockets for moisture ) as well as epoxy glass to
another layer of epoxy glass. The more contacts of the same glass to
glass the stronger the bond. FR4 with solder mask over the outside layer
is tough and will not delaminate easily when properly manufactured. It
really can take a lot of abuse. I have seen other materials that are
very delicate. They need to be baked at 215 deg C for 4 hours prior to
wave solder or there will be delamination.
        Regards,
        Ramon


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, October 20, 2005 9:26 AM
To: [log in to unmask]
Subject: Re: [TN] More on Delamination

Hi Steve,
I do not think you can make that assumption--the moisture absorption
will be pretty uniform after a couple of days.
The problem is more with solid P/G layers on dry baking, where more
moisture remains near the middle of the PWB.

Werner

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