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October 2005

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Subject:
Re: Delamination at Thermal Via area?
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Oct 2005 19:15:10 EDT
Content-Type:
text/plain
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In a message dated 10/19/05 17:23:15, [log in to unmask] writes:
> Hi Leo!
>
> Your pics are up! Go to:
>
> http://www.stevezeva.homestead.com/files/Delam_in_Via.jpg
> http://www.stevezeva.homestead.com/files/Dalam_in_Via_Close.jpg
>
 Hi,
What this pics show is a classical case of 'resin recession.' It happens with
PTV-barrels all the time; however, the term 'resin recession' is a misnomer.
During excursion to soldering T's, the polymeric fill will expand more than
the Cu-barrel and push the Cu-caps outward plastically deforming them. On
cooling, the resin 'recedes' to its original volume, the plastically deformed Cu
cannot follow, and you have this classic case of 'resin recession.'


Werner

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