Werner,

"Too Fast and too hot" were designated by me during an evaluation to try
and generate delamination blisters and "correct" was a profile I would
use for reflow assembly.  "Too fast and too hot" happens to be
3.5C/second ramp and a peak of 263C and "Correct" happens to be
2.3C/sec. and a peak pf 221C  


Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, October 19, 2005 4:35 PM
To: [log in to unmask]
Subject: Re: [TN] Delamination at Thermal Via area?

Hi,
For the 'Blister 3' sections it is stated: "Reflowed with too fast a
ramp and too hot a profile" for the blistered section and "Assembled
with correct profile" for non-blistered one. How were the profile
designated "too hot" and "correct"? What is "too hot" and "correct"?
"Too hot" and "correct" for what purpose?



Werner

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