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October 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Wed, 19 Oct 2005 12:32:33 -0400
Content-Type:
text/plain
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text/plain (132 lines)
Appears that the copper landing site is lifting from the base material
or plating from the foil.  This could be due to poor
planarization/removal or via fill material prior to deposition.    

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen R Gregory
Sent: Wednesday, October 19, 2005 10:30 AM
To: [log in to unmask]
Subject: Re: [TN] Delamination at Thermal Via area?

                                Hi Wee Mei!

                                I've got your pictures posted. Go to:

 
http://www.stevezeva.homestead.com/files/U2_top.JPG
 
http://www.stevezeva.homestead.com/files/U2_bottom.JPG
 
http://www.stevezeva.homestead.com/files/U2_delamination.JPG

                                Are the vias filled? Are you seeing this
delamination on very many
                                PCB's? Are you seeing it only on the
bottom of the PCB?

                                Kind regards,

                                -Steve Gregory-
                                Senior Process Engineer
                                LaBarge Incorporated
                                Tulsa, Oklahoma
                                (918) 459-2285
                                (918) 459-2350 FAX





        Wee Mei <[log in to unmask]>
                        Sent by: TechNet <[log in to unmask]>
                        10/19/2005 03:47 AM
                        Please respond to TechNet E-Mail Forum
<[log in to unmask]>; Please respond to Wee Mei <[log in to unmask]>
                                	
        To:     [log in to unmask]@SMTP@Exchange
        cc:     (bcc: Stephen R Gregory/LABARGE)
        Subject:        [TN] Delamination at Thermal Via area?	


                                Hello,

                                Just asked Steve to download 3 pictures
on the defects. Kindly take a look
                                at them and would appreciate some
feedback on the possible root cause.

                                Steve : Thanks for the downloading.

                                Regards,
                                Wee Mei

 
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by the individual or entity named above.  If you are not the intended
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