what Valerie mentions in her e-mail is true. there are also many other
factors that influence the final results the fabricator obtains - HASL never
was a "fine fit" for fine-pitch; but OEM's kept on insisting and never
asking the fabricator for an alternative - so the fabricators answer was
HASL to everything.
back in the day some OEM's would ask for immersion tin - think of the the
tin being deposited back then as a coating over the copper - almost like a
metallic coating. then these boards would be fused - this was like a
mettalic OSP..............
personally; i would seek other alternatives...there are so many surface
finishes available on the market today.
i truly believe the OEM's are making more out of these surface finishes than
need to be (this is all brought about by the proprietary chemical
manufacturers propoganda).
how many of these boards that are manufactured today are assembled within
the first month of receipt? these boards can then be run through the wave
solder within 4 weeks of receipt - n'est ce pas?
well ok - how many thermal passes will it take to assemble them? how many
final finishes on the market will fit this criteria? ambiguous to
whiskering? there's silver...i truly believe that if you as the customer sat
down with your supplier and went through all of your specs to a final
finish...it could all be resolved......unfortunately...majority of the
fabricators haven't come out of the 1980's and there are more problems going
on today between OEM and fabricators than need be.
I was reading the few days of ENIG here - and all the different problems
that have been seen. ENIG is a coating that has been around for
decades....long before it was used in the board manufacturing sector.
if your supplier can put down his mask properly - develope it without any
residue left on the surface - and seeing that the mask he is using is
compatable with hydrogen scrubbing ( during nickel plating) and 180 odd
degree F temperatures; and he strips the metallic etch resist off properly
(tin plate); cleans and microetches the surface properly; inspects that the
catalyst temperature is fine - that the activator is not being absorbed by
the soldermask - that the stabilizer in the nickel bath is not too high -
there shouldn't be any blackpads or poor solderable areas.
again - if his gold deposit is too high - this will start corroding the
nickel underneath - if the fabricator is too low in gold salts - this will
effect the actual deposit also (might be alittle more porous than usual) -
but then you must underestand - the price of ENIG will be much more per
square inch than any of your other surface finishes available.
personally; i would truly want to sit down with my favricator and ask a
million questions and even watch as they are making some of my boards.
thankyou for listening
Rick Fudalewski
Target Technology
----- Original Message -----
From: "Valerie St.Cyr" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, October 12, 2005 6:24 PM
Subject: Re: [TN] Hasl
> Werner, Ramon
>
> Franklin is speaking tongue-in-cheek... it isn't plating and it doesn't
> start out
> as some kind of plating. It is a glorified large solder pot ... boards go
> down
> a preclean line, then get clamped (if a vertical system) or rolled (if a
> horizontal
> system) into molten PbSn. If it is a vertical system, the board with
> solder all
> over it gets extracted between air knives which "blow off" the excess
> solder,
> leaving some behind on the surface; if it is a horizontal line, the board
> passes
> between air knives as it "floats" on an air current.
>
> There are many things that can happen. Solder deposits are highly
> dependent
> on feature sizes; on top vs bottom (where top is both top sides of the
> board in
> vertical mode, and one full side in horizontal mode - bottom being the
> opposites). Flux, drag time, cool down, rate of extraction, orientation of
> the
> board, phase of the moon, condition of the solder bath, etc and so forth
> all conspire to make a process that is fine unless you need highly
> consistent,
> board to board, feature to feature, day to day results.
>
> And then, as someone mentioned, the fabricators are mostly likely going to
> put dents into the solder pads when they do electrical test.
>
> It can be done; it has its place. Fine pitch (which I arbitrarily define
> for my
> own use as .020" or less) isn't a good fit with HASL.
>
> Valerie
>
>
>
>
>
>
> Franklin D Asbell <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 10/12/2005 06:07 PM
> Please respond to TechNet E-Mail Forum; Please respond to Franklin D
> Asbell
>
>
> To: [log in to unmask]
> cc:
> Subject: Re: [TN] Hasl
>
>
> It's not? Then why is our HASL containing molten solder and air actuated
> immersion clamps, also air actuated, plugged into the wall, doesn't that
> mean current is being applied to the work, the current flows through
> things
> we cannot see, into the molten solder, onto the work, and the clamps are
> acting as cathodes...hmmmm.... (chuckle) Of course it is not plating, did
> I
> say something dumb again and lead people to believe that I thought it was?
> Sorry, must have been a momentary loss...
>
> Franklin
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> Sent: Wednesday, October 12, 2005 4:29 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
> Hi Ramon & Franklin,
> HASL is not a plating. It may start out as such--you co-plate tin and
> lead as an etch-resist on your PWB, but after melt-fusing it, it
> definietely is no longer a plating--it is now propely 'wetted' to the
> underlying Cu. HASL is simply blowing away the excess solder to produce
> as level a surface as posible.
> Franklin is correct with all the variables and caveats listed.
> Werner
>
> -----Original Message-----
> From: Dehoyos, Ramon <[log in to unmask]>
> To: [log in to unmask]
> Sent: Wed, 12 Oct 2005 16:24:59 -0400
> Subject: Re: [TN] Hasl
>
> Frank:
> At what pitch does one have to apply all these measures
> listed below to avoid issues with the boards? Is it bigger than 10, or
> 25 or 50 mils pitch? Do you have similar problems with SSSR ( Selective
> solder strip and reflow ) as with HASL plating?
> Regards,
> Ramon
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Franklin Asbell
> Sent: Wednesday, October 12, 2005 2:06 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
> That's not exactly what I said, the question was " I would like to know
> if HASL plating creates a planarity problem for QFPs or BGAs assembly
> for some people in the industry."
>
> I responded with yes, it creates problems!
>
> Can HASL be correctly applied down to tight pitch features (my
> definition of tight pitch is 10 mils or less), of course! But there are
> many variables on both sides of the wall that should be addressed first,
> for example, air/dwell time during the HASL process removing as much
> solder from the flat pads but allowing just enough to remain behind as
> to provide the solderable surface, possible stencil adjustments, paste
> application (to adjust for minimal solder and stencil thickness
> adjustments), then there may be the type solder to use (as the extreme
> minimal solder on the bare board may invariably require a different
> temperature setting during assembly), what type flux is being used,
> would this interfere instead of enhance the fusing of the board and
> paste...and the list here may be long.
>
> The list above contains many of the variables of why it does not
> work...of course...
>
> Can it be done, sure, but the cost associated with this as well as the
> potential for low yields make alternative (i.e immersion tin) finishes a
> better choice.
>
> Franklin
>
>
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
> Sent: Wednesday, October 12, 2005 12:40 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
>
> Frank:
> Your are telling me that HASL final plating can be used
> on most components including fine pitch if they are design in properly
> and the assembly is done by skilled people and six more variables are
> correctly done. Is this right?
> Regards,
> Ramon
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
> Sent: Wednesday, October 12, 2005 1:29 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
> Like Chinese fireworks and printed circuit boards.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Franklin Asbell
> Sent: Wednesday, October 12, 2005 12:25 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
> Is that your question? The answer is yes, for some people it does, but
> it cannot be blamed solely on HASL, you need to factor the HASL process,
> the dimensions of components being attached, the skill level of those
> people and about half a dozen other variables.
>
> And just a not on planarity, HASL and planarity go together like Laurel
> and Costello, Abbot and Hardy, Beer and Firearms...
>
> Franklin
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
> Sent: Wednesday, October 12, 2005 12:16 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
>
>
> Thanks Jeff. Is it from pad to pad or from thickest to thinnest
> pad areas of the board? I would like to know if HASL plating creates a
> planarity problem for QFPs or BGAs assembly for some people in the
> industry.
> Regards,
> Ramon
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeffrey Bush
> Sent: Wednesday, October 12, 2005 12:00 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
> We control the thickness from .2 to .9 mils - pad centers. We use a
> HSL-175 horizontal system.
>
> Jeffrey Bush
> Director, Quality Assurance and Technical Support
>
> VERMONT CIRCUITS INCORPORATED
> 76 Technology Drive - POB 1890
> Brattleboro, Vermont 05302
> Voice: 802.257.4571.21 Fax: 802.257.0011
> http://www.vtcircuits.com
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
> Sent: Wednesday, October 12, 2005 9:06 AM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
>
> Thanks for your comments Dr Lee. I would like to know
> from the fabricators what is the range in thickness that they can
> control on a HASL plating finish. Is it 0.1 to 0.6 mills? From the
> fabricators what is the finest part pitch that they can assemble on
> PWBs.
> Thanks for your inputs.
> Ramon
> ME
> 410.552.2210
>
>
>
>
> _____
>
> From: Lee parker [mailto:[log in to unmask]]
> Sent: Tuesday, October 11, 2005 8:10 PM
> To: TechNet E-Mail Forum; Dehoyos, Ramon
> Subject: Re: [TN] Hasl
>
>
> Ramon
>
> Normally, HASL is the less expensive alternative and thinner.
> Consequently by being thinner, it may produce a smaller meniscus which
> is usually an advantage. The risk here though is solderability; the
> thinner the solder the more likely the occurrence of surface
> intermetallics. These issues have been the focus of engineering
> attention for years and have become more acute as the feature sizes
> diminished. This is why the the industry is migrating from HASL to hard
> metal finishes.
>
> Best regards
>
> Lee
>
> J. Lee Parker, Ph.D.
> JLP Consultants LLC
> 804 779 3389
>
> ----- Original Message -----
> From: Dehoyos, Ramon <mailto:[log in to unmask]>
> To: [log in to unmask]
> Sent: Tuesday, October 11, 2005 4:20 PM
> Subject: Re: [TN] Hasl
>
> Thanks Dr Parker and Richard for your inputs. Comparing
> SSSR and
> HASL final plating which are made both using eutectic Tin/Lead
> solder
> and other Lead free materials, the end surface is still domed in
> the
> middle. So both have weak gasketing due to their lack in
> flatness.
> Setting this issue aside, what are the advantages of one versus
> the
> other besides the longer shelf life of SSSR.
> Regards,
> Ramon
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem,
> Richard
> Sent: Tuesday, October 11, 2005 2:03 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
> The idea of the flat surface finish is for both stencil
> gasketing to the
> board and for placement accuracy. To form a "perfect brick" of
> solder
> paste, there has to be a certain amount of pressure (a lot less
> than
> most people think). To prevent squeezout of paste between
> stencil and
> board, there has to be good, really good, gasketing or sealing
> between
> the stencil and the board surface.
> The problem with HASL, as Dr. Parker stated below, is that the
> round
> bump (meniscus) of HASL sticking up above the surface of the pad
> on vias
> and on surfaces where there is no accomodating hole in the
> stencil
> prevents this tight seal, and allows the paste to squeeze out.
> (The
> aperture design is typically slightly smaller than the pad). It
> is also
> a problem when you go back and perform pick-n-place, as now you
> want to
> place the SMT components onto your perfectly formed bricks of
> paste, but
> with about 50-100 grams of pressure. If the paste is not stable
> to a
> flat pad, the parts slide all over the place. While some of this
> is
> forgiven by the surface tension of the solder in liquidus,
> bridges do
> form, components misalign, etc. This is especially critical in a
> no-clean process. If large (relatively) amounts of the solder
> paste are
> not "tight to the brick" and fully registered on the pad, the
> paste does
> not fully agglomerate into a single solder joint. Separated
> solder paste
> does not usually conglomerate back into the central solder joint
> during
> reflow. Extraneous solder balls form. This is very bad news if
> you did
> not plan on washing them away.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
> Sent: Tuesday, October 11, 2005 12:03 PM
> To: [log in to unmask]
> Subject: Re: [TN] Hasl
>
> Ramon
>
> After reflowing a soldered surface, you will form a meniscus
> which will
> interfere with SMT component placement. To avoid the problem I
> suggest a
> flat metal finish such as immersion silver or flash gold (not
> ENIG)
>
> Best regards
> Lee
>
> J. Lee Parker, Ph.D.
> JLP Consultants LLC
> 804 779 3389
> ----- Original Message -----
> From: Dehoyos, Ramon<mailto:[log in to unmask]>
> To: [log in to unmask]<mailto:[log in to unmask]>
> Sent: Tuesday, October 11, 2005 12:52 PM
> Subject: [TN] Hasl
>
>
>
> Hi technetters:
> Is there a fine pitch limit to the use of HASL
> board
> plating
> finish due to its variation in thickness? Does selective
> solder strip
> and reflow plating, SSSR, have a significant advantage over
> HASL? Any
> comments relating to platting finish would be greatly
> appreciated. I
> thank you for your comments.
> Ramon
> ME
> 410.552.2210
>
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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