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Subject:	RoHS Pressfit Connector
From:	Frank Kimmey <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Frank Kimmey <[log in to unmask]>
Date:	Tue, 4 Oct 2005 08:37:20 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

A little help would be appreciated here.

I have been tasked with selecting the "right" RoHS finish for our PCBAs.
Until now I think it's been pretty easy, just choosing between ENIG and IAg.

Now I have run into an issue that has me unsure.

Due to a short window (no time to experiment) and materials available here is what I'm up against.

I need to convert an assembly that uses a 50+ pin pressfit connector from Sn/Pb over Ni going into HASL.
The new connector is Sn over Ni and cannot be sourced elsewhere (customer requirement)
The new PCB can be either ENIG or IAg.
The connector has a customer required "no solder to be used".
My worries are:

1. How bad will tin whisker issue get? And is there anything I can do?
2. Will IAg have more problems due to environmentals (sulfur, etc.)
3. Since we call out 40 to 150 u" of Ni in our ENIG will barrel damage likely rear its ugly head?

This connector does require considerable force to install (in this case press fit means equipment to be used).
I think that once pressed in, then the connector to copper mechanical connection may be enough.
So I am leaning towards IAg.
Your thoughts and comments are highly appreciated.
Thanks,
FNK

Frank N Kimmey CID+
Principal PCB Designer
Powerwave Technologies Inc
Office 916-941-3159
Fax 916-941-3195
Cellular 916-804-2491

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