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October 2005

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Wed, 12 Oct 2005 11:12:50 -0400
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Valerie,

Have you published the results of your microvoid investigation? 


Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Valerie St.Cyr
Sent: Wednesday, October 12, 2005 10:45 AM
To: [log in to unmask]
Subject: Re: [TN] Hasl

All,
Please see the current issue of Assembly Magazine for an article titled:
"Avoiding Microvoids" by Don Cullen; This article is based on a paper
presented at the 2005 Electronic Circuits World Conference, which was
held Feb. 22-24 in conjunction with APEX and the IPC Printed Circuits
Expo.
(now that I've given full credit and references ...). Here are some
teasers:

Initial Investigation
Our investigation of microvoids and immersion silver was prompted by the
high-visibility failure of a ball grid array (BGA) on a PCB during
postassembly power cycling. Microvoids were the culprit. But, what
caused the microvoids?

The Perfect Storm
Our experiments indicated that several factors were necessary to produce
microvoids. Intuitively, this seemed correct.

Preventing Microvoids






"Gerard O'Brien" <[log in to unmask]> Sent by: TechNet
<[log in to unmask]>
10/12/2005 10:00 AM
Please respond to TechNet E-Mail Forum; Please respond to "Gerard
O'Brien"


        To:     [log in to unmask]
        cc:
        Subject:        Re: [TN] Hasl
Richard - great come back - perhaps you have missed all the champagne
voiding issues with silver! Ask Cisco, et al, the great proponents of Ag
what their finish de jour is - it is no longer Ag. All surface finishes
come with a price if not applied correctly.





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