LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

October 2005

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET October 2005

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: Hasl
From:	"Valerie St.Cyr" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Wed, 12 Oct 2005 10:45:00 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (54 lines)

All,
Please see the current issue of Assembly Magazine for an article titled:
"Avoiding Microvoids" by Don Cullen; This article is based on a paper
presented at the 2005 Electronic Circuits World Conference, which was held
Feb. 22-24 in conjunction with APEX and the IPC Printed Circuits Expo.
(now that I've given full credit and references ...). Here are some
teasers:

Initial Investigation
Our investigation of microvoids and immersion silver was prompted by the
high-visibility failure of a ball grid array (BGA) on a PCB during
postassembly power cycling. Microvoids were the culprit. But, what caused
the microvoids?

The Perfect Storm
Our experiments indicated that several factors were necessary to produce
microvoids. Intuitively, this seemed correct.

Preventing Microvoids






"Gerard O'Brien" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
10/12/2005 10:00 AM
Please respond to TechNet E-Mail Forum; Please respond to "Gerard O'Brien"


        To:     [log in to unmask]
        cc:
        Subject:        Re: [TN] Hasl
Richard - great come back - perhaps you have missed all the champagne
voiding issues with silver! Ask Cisco, et al, the great proponents of Ag
what their finish de jour is - it is no longer Ag. All surface finishes
come
with a price if not applied correctly.





---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG