John,
As you know from our past interactions I'm in your camp especially when
it comes to 100%Sn. My response to Phil wasn't a suggestion that Sn100C
was better than SAC 305. I was only questioning his suggestion that SAC
305 was IPC's alloy of choice for wave soldering.
Regards,
George
George M. Wenger, Andrew Corporation
Reliability / FMA Engineer
Base Station & Subsystems Group
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [log in to unmask]
-----Original Message-----
From: John Maxwell [mailto:[log in to unmask]]
Sent: Tuesday, October 11, 2005 7:03 PM
To: TechNet E-Mail Forum; Wenger, George M.
Subject: Re: [TN] SAC 305 versus Sn100C
Alas, I wish I was consulting again as this would be money in the bank
for those using 100% Sn. Brittle brittle brittle, my old Chemical Rubber
handbook describes tin as the crying metal due to crystal cracking. Rel
testing that I ran on both reflow and thru hole assemblies lead me to
abandon Sn100 and Sn99C due to solder joint cracking so lots of luck.
John maxwell
Wenger, George M. wrote:
>Phil,
>
>Did I miss something on TN? You made the comment that "Sn100C is less
>expensive than SAC 305(the IPC alloy of choice)." Has the IPC come out
>and indorsed SAC 305 for Pb-Free wave soldering? I know the IPC Solder
>Products Value Council has indicated that "the 96.5/3.0/0.5 SAC alloy
>be the lead free alloy of choice for the electronics industry" but that
>was based on their surface mount assembly and reliability evaluation
not
>on a wave soldering evaluation.
>
>Regards,
>George
>George M. Wenger, Andrew Corporation
>Reliability / FMA Engineer
>Base Station & Subsystems Group
>40 Technology Drive, Warren, NJ 07059
>(908) 546-4531 [log in to unmask]
>
>
>
>
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