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October 2005

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Subject:
From:
John Maxwell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Maxwell <[log in to unmask]>
Date:
Tue, 11 Oct 2005 16:03:06 -0700
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text/plain (42 lines)
Alas, I wish I was consulting again as this would be money in the bank
for those using 100% Sn. Brittle brittle brittle, my old Chemical Rubber
handbook describes tin as the crying metal due to crystal cracking. Rel
testing that I ran on both reflow and thru hole assemblies lead me to
abandon Sn100 and Sn99C due to solder joint cracking so lots of luck.

John maxwell

Wenger, George M. wrote:

>Phil,
>
>Did I miss something on TN?  You made the comment that "Sn100C is less
>expensive than SAC 305(the IPC alloy of choice)."  Has the IPC come out
>and indorsed SAC 305 for Pb-Free wave soldering?  I know the IPC Solder
>Products Value Council has indicated that "the  96.5/3.0/0.5 SAC alloy
>be the lead free alloy of choice for the electronics industry" but that
>was based on their surface mount assembly and reliability evaluation not
>on a wave soldering evaluation.
>
>Regards,
>George
>George M. Wenger, Andrew Corporation
>Reliability / FMA Engineer
>Base Station & Subsystems Group
>40 Technology Drive, Warren, NJ 07059
>(908) 546-4531 [log in to unmask]
>
>
>
>

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