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October 2005

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Tue, 11 Oct 2005 16:02:11 -0400
Content-Type:
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text/plain (76 lines)
	
        Some form of wire bonding is done using ultrasonic bonding of
gold or aluminum wire( very thin wire ), other way could be using
conductive epoxy.  Soldering to ENIG over copper finish is done with
regular eutectic tin/lead or lead free and flux. My two cents.
        Regards,
        Ramon 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Hodge
Sent: Tuesday, October 11, 2005 3:39 PM
To: [log in to unmask]
Subject: Re: [TN] <List>[TN] wire bonding

Some would say "prayer". I do not believe that you would use anything
except the wedge bonder and the aluminum wire leads. I may be wrong.


At 01:42 PM 10/11/2005, you wrote:
>Question for the assemblers:
>
>When wirebonding to ENIG, do you use any solder paste or other
"facilitator"
>
>to create the bond?
>
>Thanks for your reply...
>
>
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