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October 2005

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Subject:
Re: <List>[TN] wire bonding
From:
Steve Hodge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Hodge <[log in to unmask]>
Date:
Tue, 11 Oct 2005 13:39:20 -0600
Content-Type:
text/plain
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text/plain (46 lines) 
Some would say "prayer". I do not believe that you would use anything
except the wedge bonder and the aluminum wire leads. I may be wrong.


At 01:42 PM 10/11/2005, you wrote:
>Question for the assemblers:
>
>When wirebonding to ENIG, do you use any solder paste or other "facilitator"
>
>to create the bond?
>
>Thanks for your reply...
>
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