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October 2005

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Subject:
From:
Tom Oliver <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tom Oliver <[log in to unmask]>
Date:
Fri, 7 Oct 2005 13:27:09 -0400
Content-Type:
text/plain
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text/plain (93 lines)
The core is failing after panelization / singulation.
Our boards come in an array form of 20 individual circuit boards on a 4" by
12" array that we use a singulation process to break out the individual
boards from the main array that are held in place by two 0.060 tabs. We have
lots of support for the boards and we could not find any flexing of the
board at this process.
The cooling rate I will check on that
No dry film under the inductor
Thx's
Tom
----- Original Message -----
From: "Roger Stoops" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, October 07, 2005 1:04 PM
Subject: Re: [TN] Ferrite Core Inductors Fracturing Help


Is the core/component failing before or after panelization?
Is the board being flexed in any way before the part is determined to be
broken?
Is the cooling rate after reflow appropriate for the component?
Is dry film SM being used on the board, esp. under the inductor?

Regards,
Roger

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tom Oliver
Sent: Friday, October 07, 2005 12:53 PM
To: [log in to unmask]
Subject: [TN] Ferrite Core Inductors Fracturing Help

Good Afternoon
I have been a long time reader and learner and this is my first question
to ask.

We are having a problem with our 1002 series Ferrite core chip
inductors, fracturing during our processes.The core actually fractures
causing us failures electrically.
We checked the chip shooter to be sure it was set correctly for the
height of the chip these are High Q component and run about .008 thicker
then our normal non ferrite core inductors, and it was. We checked with
our supplier and they stated it passed there push test but did not
reference any type of spec. Reading there test report it appears that
the push test is checking to be sure the termination is not separating
from the core.

Our problem is the core is fracturing and the component is actually
breaking.

My question is there a IPC spec that we can reference that relates to
the strength or integrity of the ferrite core, along with a spec on how
much abuse they can take for example at singulation.

Thx's in advance

I have some pictures that I can post at Steves site if he gives the
approval.

Thomas Oliver
QC Coordinator
Eagle Comtronics

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