TECHNET Archives

October 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Arnaud GRIVON <[log in to unmask]>
Reply To:
Date:
Tue, 4 Oct 2005 13:50:16 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
TechNetters,

Due to copper trace cracking on a flex assembly, we would like to
characterize the copper ductility.
The crack occurs at a trace to pad junction on a specific batch, and a
variation of the copper ductility is suspected.
Any idea on how to assess it? I am suggested a Vickers hardness
measurement, but I am unsure it can really be correlated to the exposed
problem.
Note also that the measurement would have to be done on manufactured
flex, not specific coupons.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2