Hi Clayton,
First, the biggest difference inpads should be—but rarely is, whether the 
soldering process is wave or reflow soldering. You need a large pad so the wave 
can touch it. for reflow soldering, the pad needs only to be the sam size as 
the component metallization—but rarely is because of old habits.
Second,   because of the drawbridging/tombstoning problem, the pads should be 
as small as possible—quite a contradiction. Trying to avoid this problem 
accounts, at least to some extent, for the various shapes.
I certainly would not use a large, one-size-fits-all pad option.



Werner

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