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Subject:	Re: New IPC email forum
From:	DUTTON Phil <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, DUTTON Phil <[log in to unmask]>
Date:	Thu, 6 Oct 2005 09:44:39 +1000
Content-Type:	text/plain
Parts/Attachments:	text/plain (46 lines)

As a designer, I value all of the information regarding both fabrication
and assembly. If it splits, I'll just subscribe to both anyway.

Phil Dutton C.I.D.+


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Franklin Asbell
Sent: Thursday, 6 October 2005 12:35 AM
To: [log in to unmask]
Subject: [TN] New IPC email forum


With a show of hands (yes, we can see you) how many out there would be
interested in subscribing to an IPC email forum for pcb (rigid, flex,
rigid-flex, hi-rel, mil, etc) fabrication topics.

Franklin

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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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