I thought the trend is more towards integration.... the package on package
(pop), chip scale package and stacking chips are more and more like a
PWA...Every thing is move towards smaller, molded together, plug in and
play... more of flex, high density stuff hard to say it is a device or PWA
(substrate or pcb? if you mount 4 chips/packages on the same substrate,
what is called? MCM or PWA?)...I would like to tap into substrate, pcb,
flex, assembly, chip, wire bonder, design, test, etc. etc. all in one =
TechNet... why you are not happy? why you dump me? you don't like me
anymore? haaaaa!!! (just kidding)...
jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dehoyos, Ramon
Sent: Wednesday, October 05, 2005 2:59 PM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum
Second the motion. Bob, I could not have said it better than this.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Metcalf
Sent: Wednesday, October 05, 2005 12:48 PM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum
I like the fact that this forum covers both assembly and fab issues. I
believe assembly and fab issues go hand in hand. Fab houses need to
understand the challenges that assemblers face and the assembly people
need to be aware of the challenges of the fabrication process.
Bob Metcalf
Circuit Solutions
949-709-2544
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bloomquist, Ken
Sent: Wednesday, October 05, 2005 8:41 AM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum
I lean towards the camp of keeping everything here. I really appreciate
reading the Q&A's regarding board fab although I'm only an OEM. If there
was another forum for board fab only I probably would not subscribe.
Thanks for asking,
KennyB
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