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October 2005

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Subject:
From:
"Stadem, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:
Wed, 5 Oct 2005 12:50:27 -0500
Content-Type:
text/plain
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text/plain (139 lines)
I have to agree with Cheryl and the rest of the no's. 
I originally signed onto the forum looking for additional information on
assembly issues. My career background has been in electronics assembly
at Honeywell, General Dynamics, Pemstar, ADC, and other companies,
including my own. I have done this for almost 40 years. 

I have learned more on this forum than anywhere else. It is extremely
valuable to me.

In recent years I have been more involved in issues from the fabrication
standpoint that affect the upper level assembly, such as final finishes,
via-in-pad, pad design, factors affecting thermal dynamics, complex
multi-layer boards, etc, etc.
The information shared by the fabricators has been a tremendous help to
me and to others who do not know a lot about the fabrication side, those
who have never worked in the fabrication industry.
 
I certainly hope the fabricators feel welcome to the forum as it stands
today. In fact, I hope everybody feels welcome to the forum as it is. If
the fabricators end up with their own forum, most of the topics would be
only about fabrication issues, but not how they may affect assembly,
reliability, etc. I think that would not be a good thing for the
industry as a whole. We need more integration, more input from every
aspect of the industry. I think the forum as it stands today has helped
to break down the walls between assembly OEMs and CEMs and the pwb
industry. We need to pursue more of this, not less. 
Splitting up the forum could only make it worse for both worlds. My
opinion: bad idea.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cheryl Johnson
Sent: Wednesday, October 05, 2005 11:40 AM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum

RoHS already has the leadfree forum:
[log in to unmask] (same sign up as for TN)

I really fear having issues looked at from a purely fab versus purely
assy (versus purely test or whatever...).
The more eyes and angles looking at our issues, the better answers we
all will have access to.

I vote to keep it all here.

Sincerely,
-----------------------------------
Cheryl Johnson, C.I.D.+
Manager
ExcelStor US Office, Engineering Services
Email: [log in to unmask]
Tel: (303) 684-7291
Fax: (303) 684-7268
Mobile: (303) 809-5815
-----------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of TDK
Sent: Wednesday, October 05, 2005 9:08 AM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum


I am in...

In light of the RoHS issues, this is very important to help all of us
navigate thru the "RoHS" waters.

Regards
TDK



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Franklin Asbell
Sent: Wednesday, October 05, 2005 9:05 AM
To: [log in to unmask]
Subject: [TN] New IPC email forum

With a show of hands (yes, we can see you) how many out there would be
interested in subscribing to an IPC email forum for pcb (rigid, flex,
rigid-flex, hi-rel, mil, etc) fabrication topics.

Franklin

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