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October 2005

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Subject:
From:
Judy Brown <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Judy Brown <[log in to unmask]>
Date:
Wed, 5 Oct 2005 10:07:29 -0700
Content-Type:
text/plain
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text/plain (78 lines)
I second that!

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Metcalf
Sent: Wednesday, October 05, 2005 9:48 AM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum

I like the fact that this forum covers both assembly and fab issues. I
believe assembly and fab issues go hand in hand. Fab houses need to
understand the challenges that assemblers face and the assembly people
need
to be aware of the challenges of the fabrication process.

Bob Metcalf
Circuit Solutions
949-709-2544

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bloomquist, Ken
Sent: Wednesday, October 05, 2005 8:41 AM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum


I lean towards the camp of keeping everything here. I really appreciate
reading the Q&A's regarding board fab although I'm only an OEM. If there
was another forum for board fab only I probably would not subscribe.

Thanks for asking,

KennyB

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information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
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