Why fill then cap the vias? Via capping alone should work
without via filling. Keep in mind that via capping is with
a dryfilm soldermask then covered with an LPI soldermask.
It does cost more for this approach so it should only be
used if via plugging won't work for you. (via plugging
typicllay fills 1/3 of the barrel of the via and should
only be done from one side.)

Thank you,
Eddie Rocha
South Bay Circuits



Hello, all,
Since the designers (whos vision of the product has a gap
starting in the end of the PCB design until they see the
assembled board) placed capacitors on the fan-out vias of
every 1 mm BGA. No need to say that the vias are through
holes, with drill diameter of 0.3 mm (12 mils). This
doesn't leave much hope for the soldering. My solution is
to fill the vias, then cap them.

Can somebody suggest DFM for the PCB design, that will ease
the PCB manufacturer's task? I mean - the minimum common
baseline, so maximum fabricators will be able to deal with
it.

Regards

Ofer Cohen
Seabridge - a Siemens company

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