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October 2005

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Subject:
Re: More Electrolytic Tin Plating
From:
Aleks Lozinsky <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Aleks Lozinsky <[log in to unmask]>
Date:
Tue, 18 Oct 2005 08:24:27 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (63 lines) 
Hi Rudy,
What about throwing power of pure Tin fluoborate solution? From what I tried
several years ago this solution, using standard organic additives for
fluobarate tin/lead bath, has not so good throwing power compare to MSA or
Sulfuric Acid based Tin plating solutions. It's easy to see on Hull Cell
test panel and if implemented can lead to etch voids.
Aleks Lozinsky
Technic Canada
----- Original Message -----
From: "R Sedlak" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, October 17, 2005 9:29 PM
Subject: [TN] More Electrolytic Tin Plating


Sona:

I do not recommend your "plating" the lead out of your Tin/Lead bath, it is
too uncontrolled.
(And actually, it would, theoretically, take you forever to get to true
"no-lead"..it would just keep getting less and less.)

I do recommend you start over, using the fluoborate electrolyte system,
rather than the sulfate, or methane sulfonate system.

Sorry to have been unclear in my recommendation.

I think the Fluoborate electrolyte is THE way to go, but if you go there, do
it suddenly, not gradually.

And always remember, free advice is often not worth what you paid for it...

Rudy Sedlak



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