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October 2005

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 12 Oct 2005 13:21:18 -0400
Content-Type:
text/plain
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Hi Joel,
I do agree with Lee Parker. I am glad you had no problems with
ENIG--many of my cients were not this lucky.
Werner Engelmaier


-----Original Message-----
From: Joel Mearig <[log in to unmask]>
To: [log in to unmask]
Sent:         Tue, 11 Oct 2005 12:54:21 -0700
Subject: Re: [TN] Hasl

   Lee,
Good input that I agree with. However, I was wondering if you could
further
discuss the "flash" vs. "ENIG" issue. I have been using ENIG on my
Pb-free
assemblies for about 7 years with very little problems. If I am missing
something further education would be extremely helpful. Thanks

Joel Mearig
Delta Tau Data Systems, Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
Sent: Tuesday, October 11, 2005 10:03 AM
To: [log in to unmask]
Subject: Re: [TN] Hasl

Ramon

After reflowing a soldered surface, you will form a meniscus which will
interfere with SMT component placement. To avoid the problem I suggest a
flat metal finish such as immersion silver or flash gold (not ENIG)

Best regards
Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
  ----- Original Message -----
  From: Dehoyos, Ramon<mailto:[log in to unmask]>
  To: [log in to unmask]<mailto:[log in to unmask]>
  Sent: Tuesday, October 11, 2005 12:52 PM
  Subject: [TN] Hasl



              Hi technetters:
              Is there a fine pitch limit  to the use of HASL board
plating
  finish due to its variation in thickness?  Does selective solder strip
  and reflow plating, SSSR, have a significant advantage over HASL? Any
  comments relating to platting finish would be greatly appreciated. I
  thank you for your comments.
          Ramon
          ME
          410.552.2210

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