IPC-600-6012 Archives

October 2005

IPC-600-6012@IPC.ORG

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Subject:
From:
John Perry <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Wed, 19 Oct 2005 16:55:23 -0500
Content-Type:
multipart/mixed
Parts/Attachments:
Colleagues,

 

Listed here is the agenda for our joint IPC-A-600 (7-31a) and IPC-6012
(D-33a) task group meeting which takes place Sunday, October 23rd from
10:00 am - 3:00 pm in Room 305 of the Sands Convention Center in Las
Vegas, NV as part of IPCWorks 2005.  As always there will be lot's to
discuss:

 

1) Review minutes and action items of the last meeting, including
reduction of surface wrap copper in plated-through holes, resolution
capability and the usage of mm/in and um/uin dimensioning.

 

2)    Review of wording in 3.6 in IPC-6012B relative to production
boards:

            Regarding the text "boards may be used in lieu of coupons",
we should further put words that state all inner layer connections and
build shall be able to be evaluated.  It is a little loose and someone
could take three holes with one inner layer connection on a 12 layer
board and some of the conductors and dielectric spacings would not be in
the field of view - Susan Mansilla, Robisan Laboratory

 

3)   Review presentation on request to tighten bow and twist
requirements - Don Dupriest, Lockheed Martin

 

4)   Review requested deletion of "which contain multiple printed
boards" from 3.4.3 of IPC-6012B - Mike Green, Lockheed Martin

 

5)   Review alteration of Note 3 within Table 3-2 of IPC-6012B relative
to microvia pad size - Randy Reed, Merix Corp.

 

6)   Review the level of industry request for certification to board
fabrication capability at the IPC level - John Perry, IPC

 

7)   Discuss new group effort to take industry data on via protection
and develop recommended attributes and their requirements following the
release of the IPC-4761 Via Protection Guideline - Susan Mansilla,
Robisan Laboratory

 

8)   Discuss the need for additional thermal stress testing at the board
shop level similar to assembly simulation in light of lead-free surface
finishes - Don Dupriest, Lockheed Martin

 

Relative to the action item review from Expo/APEX 2005, attached are a
few files:

 

February 2005 Meeting Minutes

Write-up on dimensioning rules

Collection of e-mail traffic on resolution capability - this one
contains a lot of feedback and is a significant "homework" project.
Hopefully we can take something from it and come up with a proposal at
IPCWorks.




 

Regards,

 

John Perry

Technical Project Manager

IPC

3000 Lakeside Drive # 309S

Bannockburn, IL 60015

[log in to unmask]

1-847-597-2818 (P)

1-847-615-7105 (F)

1-847-615-7100 (Main)

 



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