Happy Friday to All
I have a customer who is now being supplied with parts that the terminations
are SnAgCu (95.5/4/0.5) instead of the previous SnPb.
His process is not lead free and the parts are not always wetting and forming
an adequate joint.
What are his choices? Can he/should he take his SnPb line to lead free temps
in an attempt to solder these parts - reflow process?
Thanks for your advice
Susan Mansilla
Robisan Lab
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