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October 2005

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Wed, 5 Oct 2005 14:58:33 -0400
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Second the motion. Bob, I could not have said it better than this.




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Metcalf
Sent: Wednesday, October 05, 2005 12:48 PM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum

I like the fact that this forum covers both assembly and fab issues. I
believe assembly and fab issues go hand in hand. Fab houses need to
understand the challenges that assemblers face and the assembly people
need to be aware of the challenges of the fabrication process.

Bob Metcalf
Circuit Solutions
949-709-2544

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bloomquist, Ken
Sent: Wednesday, October 05, 2005 8:41 AM
To: [log in to unmask]
Subject: Re: [TN] New IPC email forum


I lean towards the camp of keeping everything here. I really appreciate
reading the Q&A's regarding board fab although I'm only an OEM. If there
was another forum for board fab only I probably would not subscribe.

Thanks for asking,

KennyB

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