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October 2005

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TechNet <[log in to unmask]>
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[log in to unmask], [log in to unmask]
Date:
Sun, 30 Oct 2005 13:46:13 EST
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:
Re: SV: [TN] LEAD FREE PART IN SNPB PROCESS
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From:
Werner Engelmaier <[log in to unmask]>
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Hi Ingemar,
I have to say I have not heard the terminology 'time to obtain maximum
wetting' before, and as you point out it makes no sense. there is no such thing as
'maximum wetting'--either you are properly wetted, giving you a solid layer of
IMC(s) and thus a good metallurgical bond, or you are inadequately wetted with
little or no IMC layers and thus no metallurgical bond. Just jhaving 'nice'
looking SJs is no proof of their quality.

Werner

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