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September 2005

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Subject:
From:
"Rosen D. Arabadzhiev</br>-----------------------------</br>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 1 Sep 2005 11:18:49 +0300
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Good day all,

Is there anybody who knows how can I calculate the necessary
solder paste volume, which will hold QFPs and BGAs over
bottom side of PCB during secondary side reflow process?

Thanks,
Rosen Arabadzhiev, Process Engineer
CENTILLION LTD</br>-----------------------------</br>
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