Hi Phil,

I find that on average ENIG yields better results if preheat is a little
higher than needed for HASL. But, the issue is not merely one of surface
finish. The process must be optimized for flux performance as well. Too,
much pre heat can be bad for flux. So, you can't just bump the Time
Temperature Profile up 5 degrees. You have to consider all the materials in
the process. Board finish is only one variable.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Nutting
Sent: Wednesday, September 07, 2005 9:21 AM
To: [log in to unmask]
Subject: [TN] Wave solder of ENIG


Good morning all,

As we move forward with RoHS compliance we are switching our board
plating from Tin/Lead HASL to ENIG.  We are still running our Tin/Lead
wave solder system.  Would you expect the new ENIG boards to run under
the same parameters as the HASL boards or would profiles need to be
changed?

Thanks in adavnce for your advice.

Phil Nutting

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