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September 2005

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Wed, 7 Sep 2005 09:52:54 -0400
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 Joyce,

I'm thinking of fluxes and residues of other process related materials,
possibly including dielectric mineral oil.

Phil

-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]] 
Sent: Wednesday, September 07, 2005 9:45 AM
To: TechNet E-Mail Forum; Phil Nutting
Subject: RE: [TN] Cleaning test

what is "goop"?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Nutting
Sent: Wednesday, September 07, 2005 9:29 AM
To: [log in to unmask]
Subject: [TN] Cleaning test


Here is another question,

I would like to be able to make a comparison between our standard system
assembly process and a process where the components (mostly circuit
boards, but maybe some insulators or castings) can be cleaned in a
process that can remove finger oils and other process goop.

Is there anyone in the Boston area that has the equipment and interest
in possibly helping to run this comparison?

Phil Nutting

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