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September 2005

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Wed, 7 Sep 2005 09:21:04 -0400
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Good morning all,
 
As we move forward with RoHS compliance we are switching our board
plating from Tin/Lead HASL to ENIG.  We are still running our Tin/Lead
wave solder system.  Would you expect the new ENIG boards to run under
the same parameters as the HASL boards or would profiles need to be
changed?
 
Thanks in adavnce for your advice.
 
Phil Nutting

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