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September 2005

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Fri, 30 Sep 2005 08:12:19 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (72 lines)
PLEASE FORWARD ME THE IMAGES,

jOHN

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Avanex
John Burke
Senior Manager RoHS Compliance
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40919 Encyclopedia Circle
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tel: 510 897 4250
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bhandari, DS
Sent: Friday, September 30, 2005 12:09 AM
To: [log in to unmask]
Subject: [TN] FW: bga image


Dear All,

Can anybody tell me whether these x-ray images are acceptable. I found that
few outer ball are partially cut but still 90% pad is covered with the
solder . I could not find any reference in workmanship standard for this
kind of problem. Kindly help.

 <<83.tif>>  <<076.tif>>
Best Regards
DS Bhandari
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