ON NO ACCOUNT would I recommend any abrasive process for this. The only
effect it would have would be to implant adhesive particles into the copper.

Brian

Jeffrey Bush wrote:
> This is not a normal process. I would think that chemical etching is
> more affective in removing metals and oxides from the resin surface.  We
> see no issues with SIR/MIR using standard PCB processes.  I have done
> this in the past of flex to promote stiffener bonding and mask adhesion.
> Possible the PCB house has an issue with chemical etching or base
> materials.
>
> Jeffrey Bush
> Director, Quality Assurance and Technical Support
>
> VERMONT CIRCUITS INCORPORATED
>   76 Technology Drive - POB 1890
>     Brattleboro, Vermont 05302
>       Voice: 802.257.4571.21 Fax: 802.257.0011
>            http://www.vtcircuits.com
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ivanoe Pedruzzi
> Sent: Tuesday, September 06, 2005 9:35 AM
> To: [log in to unmask]
> Subject: [TN] Sand blasting pcb after copper etching
>
> Dear Technetters,
>
> I'm not familiar with the process of making pcb and I would like to
> have your comments on something I was told from a pcb maker
> representative.
>
> "...in order to ensure a well insulation between traces, we do
> sandblasting (very little and tiny) pcb's after etching.
> this is to remove the bonding material that remains on the board after
> removing the copper. This is the only way to achieve a very good SIR
> result."
>
> Is this a normal procedure, was he correct in his claim?
>
>
> Thanks,
> Ivanoe Pedruzzi
>
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