We define not only stencil thickness required per component area but
also the aperture sizes and shapes...Typically we use component
specifications, metal layer, soldermask layer and drill data, factoring
the solder paste being used, to define the stencil we will use on
particular PCA.

Paul Edwards
Process Engineering
[log in to unmask]
Tel: 408-433-4700
FAX: 408-433-9988
Surface Art Engineering
81Bonaventura Dr.
San Jose, CA 95134
DUNS: 944740570
CAGE/NCAGE: 1XZ48
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kotecki, George
Sent: Thursday, September 29, 2005 12:05 PM
To: [log in to unmask]
Subject: [TN] Assembly data requirements

To all:
What has been your experience regarding solder mask data supplied to
contract assemblers?  Do they request or use customer supplied data or
do they prefer to generate their own stencils based on volumes?  This is
just an informal poll.   Thanks in advance

George Kotecki


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